TT Electronics/IRC

GS8B016812CT

GS8B016812CT Description

The GS8B016812CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 68.1kΩ resistance value and an exceptional ±0.25% absolute tolerance. Built using thin-film technology, this network delivers stable performance across a wide temperature range of -70°C to +125°C, with a ±100ppm/°C temperature coefficient. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision circuits. The gull-wing termination and surface-mount design ensure reliable PCB integration.

GS8B016812CT Features

• High Precision: ±0.25% tolerance and ±100ppm/°C TCR ensure minimal drift.
• Robust Construction: Ceramic case and thin-film technology enhance durability.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm SOIC package ideal for dense layouts.
• Thermal Stability: Operates reliably up to 125°C with derated power.
• Bussed Configuration: Simplifies circuit design in bus-line applications.
• Non-Automotive: Suitable for industrial and commercial use (PPAP: No).

GS8B016812CT Applications

• Precision Analog Circuits: Voltage dividers, feedback networks.
• Signal Conditioning: Sensor interfaces, ADC/DAC reference networks.
• Industrial Controls: PLCs, instrumentation, and test equipment.
• Communication Systems: Line termination, impedance matching.
• Power Management: Current sensing, load balancing.

Conclusion of GS8B016812CT

The GS8B016812CT excels in applications requiring tight tolerance, thermal stability, and compact form factors. Its ceramic construction and thin-film resistors provide superior performance over polymer-based networks, while the bussed design reduces component count in bus architectures. Though not RoHS-compliant, it remains a top choice for non-automotive precision electronics. Engineers will appreciate its reliability in harsh environments and ease of integration into high-density PCBs.