
TT Electronics/IRC
GS8B0168R0DT
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GS8B0168R0DT Description
GS8B0168R0DT Description
The GS8B0168R0DT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors, each with a 68Ω resistance and an absolute tolerance of ±0.5%. Built using thin-film technology, it offers excellent stability with a temperature coefficient of ±100ppm/°C, ensuring reliable performance across a wide temperature range of -70°C to +125°C. The SOIC package provides a compact footprint (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations for easy surface mounting. Rated for 0.05W per resistor (0.8W total) and 100V maximum voltage, it is ideal for high-density PCB designs requiring consistent resistance values.
GS8B0168R0DT Features
- Precision Tolerance: ±0.5% absolute tolerance ensures accuracy in critical circuits.
- Stable Performance: ±100ppm/°C TCR minimizes resistance drift under thermal stress.
- Robust Construction: Ceramic substrate enhances durability and heat dissipation.
- Space-Efficient: 16-pin SOIC package (9.91mm x 5.99mm) optimizes board space.
- Bussed Configuration: 15 resistors share a common node, simplifying bus line designs.
- Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive systems (non-automotive PPAP).
- Surface-Mount Ready: Gull-wing terminals enable automated assembly processes.
GS8B0168R0DT Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage dividers and pull-up/down networks in ADCs/DACs.
- Bus Termination: Impedance matching for high-speed data lines (e.g., SPI, I²C).
- Industrial Controls: Stable resistance in harsh environments (e.g., motor drives, PLCs).
- Test & Measurement Equipment: Calibration circuits requiring low drift.
- Power Management: Current sensing and feedback loops in DC-DC converters.
Conclusion of GS8B0168R0DT
The GS8B0168R0DT combines precision, compactness, and thermal resilience, making it a standout choice for engineers designing high-reliability electronics. Its bussed architecture reduces component count, while the ceramic SOIC package ensures longevity in demanding conditions. Though not PPAP-certified for automotive use, it is well-suited for industrial, telecom, and instrumentation applications where tight tolerances and stability are paramount. For designs needing repeatable performance across temperature extremes, this network delivers unmatched value.



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