TT Electronics/IRC

GS8B016982FT

GS8B016982FT Description

The GS8B016982FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 resistors with a 69.8KΩ resistance value and a tight ±1% tolerance. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C) and features a low ±100ppm/°C temperature coefficient. The device is rated for 0.05W (1/20W) per resistor and 0.8W total power dissipation, with a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances durability and thermal management.

GS8B016982FT Features

• Precision Network: 15 bussed resistors with ±1% absolute tolerance for consistent performance.
• Robust Construction: Ceramic SOIC package ensures reliability in harsh environments.
• Thermal Stability: ±100ppm/°C TCR minimizes resistance drift under temperature fluctuations.
• High Power Handling: 0.8W total power rating (0.05W per resistor) for demanding circuits.
• Compact & Durable: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm height tolerance for space-constrained designs.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive (non-AECQ) applications.
• Non-RoHS Compliant: Suitable for legacy or specialized systems requiring non-compliant materials.

GS8B016982FT Applications

• Signal Conditioning: Precision voltage division in sensor interfaces and ADC/DAC circuits.
• Industrial Controls: Bus termination and pull-up/down networks in PLCs and motor drives.
• Test & Measurement: Stable resistance networks for calibration equipment and bench instruments.
• Power Management: Load sharing and current limiting in low-power DC/DC converters.
• Legacy Systems: Maintenance or upgrades for military/aerospace hardware (non-RoHS compliant).

Conclusion of GS8B016982FT

The GS8B016982FT excels in precision, thermal stability, and power handling, making it a superior choice for high-reliability electronics. Its ceramic SOIC package and thin-film technology offer advantages over plastic-encased networks, particularly in thermal stress and long-term drift scenarios. While not automotive-grade (PPAP/No AECQ), it is ideal for industrial, instrumentation, and legacy systems requiring robust performance. Engineers will appreciate its tight tolerances, compact footprint, and bussed architecture, which simplify design while reducing component count.