TT Electronics/IRC

GS8B0171R5DT

GS8B0171R5DT Description

The GS8B0171R5DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed (BUS) configuration integrates 15 thin-film resistors with a 71.5Ω resistance value and an ultra-tight ±0.5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±100ppm/°C temperature coefficient minimizes resistance drift, while the 100V maximum voltage rating and 0.8W total power dissipation (0.05W per resistor) support robust performance in compact designs.

GS8B0171R5DT Features

• Precision Thin-Film Technology: Delivers stable, low-noise performance with ±0.5% tolerance and ±100ppm/°C TCR.
• Robust Ceramic Package: SOIC-C case style (9.91mm × 5.99mm × 1.45mm) with gull-wing termination for reliable surface mounting.
• High-Density Integration: 15 resistors in a 16-pin SOIC, ideal for space-constrained PCBs.
• Wide Operating Range: -70°C to +125°C with derated power, suited for industrial and automotive-grade applications (though not PPAP/automotive-certified).
• Low-Power Efficiency: 0.05W per resistor (1/20W) balances performance and thermal management.
• Non-RoHS Compliant: Suitable for legacy or specialized systems requiring leaded components.

GS8B0171R5DT Applications

• Signal Conditioning: Precision voltage dividers or pull-up/down networks in ADC/DAC circuits.
• Industrial Controls: PLC modules, sensor interfaces, and instrumentation requiring stable resistance values.
• Power Management: Current-limiting networks in low-power DC/DC converters.
• Legacy Electronics: Repair or replacement in non-RoHS-compliant systems.
• Test & Measurement: Calibration circuits where low TCR and tight tolerance are critical.

Conclusion of GS8B0171R5DT

The GS8B0171R5DT excels in applications demanding precision, thermal stability, and compact integration. Its ceramic construction, thin-film technology, and bussed architecture make it a standout choice for industrial, instrumentation, and legacy systems. While not automotive-grade, its wide temperature range and low TCR ensure reliability in challenging environments. Engineers will appreciate its balance of performance, density, and durability in high-accuracy designs.