TT Electronics/IRC

GS8B017681BT

GS8B017681BT Description

The GS8B017681BT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 7.68KΩ resistance value and an exceptional ±0.1% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers a ±100ppm/°C temperature coefficient, stable operation across a 70°C to 125°C derated power range, and a maximum operating temperature of 125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing termination enables easy surface-mount assembly, while its ceramic case ensures durability and thermal stability.

GS8B017681BT Features

• High Precision: ±0.1% tolerance and ±100ppm/°C TCR for accurate signal conditioning.
• Robust Construction: Ceramic substrate enhances thermal performance and longevity.
• Optimized Power Handling: 0.05W per resistor (0.8W total) with derating up to 125°C.
• Space-Efficient: Compact SOIC-C Series footprint (9.91mm length, 1.27mm pitch).
• Bussed Network: Simplified PCB layout with 15 resistors connected to a common bus.
• Wide Voltage Rating: Supports up to 100V, suitable for industrial and instrumentation use.
• Non-Automotive: Ideal for non-PPAP commercial/industrial applications.

GS8B017681BT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and DAC/ADC interfaces.
• Test & Measurement Equipment: High-accuracy signal processing and calibration.
• Industrial Controls: PLCs, sensor conditioning, and power management systems.
• Medical Electronics: Diagnostic devices requiring stable, low-drift resistance.
• Telecom Infrastructure: Signal termination and impedance matching in RF modules.

Conclusion of GS8B017681BT

The GS8B017681BT combines precision, reliability, and compact design, making it a superior choice for applications demanding tight tolerance and thermal stability. Its ceramic thin-film construction and bussed architecture reduce design complexity while ensuring consistent performance. Though not RoHS-compliant or automotive-grade, it is well-suited for industrial, medical, and telecom systems where accuracy and durability are critical. Engineers will appreciate its balance of high power density and minimal footprint, streamlining integration into space-constrained designs.