TT Electronics/IRC

GS8B018250DCT

GS8B018250DCT Description

The GS8B018250DCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 825Ω resistance value and an absolute tolerance of ±0.5%, ensuring exceptional accuracy. Built with thin-film technology, it offers a ±100ppm/°C temperature coefficient, maintaining stable performance across a wide operating temperature range of 70°C to 125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) provides robust mechanical stability, while the gull-wing termination ensures reliable PCB mounting. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is ideal for precision analog and digital circuits.

GS8B018250DCT Features

• High Precision: ±0.5% absolute tolerance and ±0.25% ratio tolerance for critical applications.
• Stable Performance: Thin-film technology with ±100ppm/°C thermal stability.
• Robust Construction: Ceramic case ensures durability and heat dissipation.
• Space-Efficient: Compact SOIC-16 package (9.91mm x 5.99mm) with 1.27mm terminal pitch.
• Wide Operating Range: Rated for -55°C to +125°C, derated to 70°C at full power.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its reliability suits industrial and telecom applications.

GS8B018250DCT Applications

• Voltage Division: Precision ladder networks in DAC/ADC circuits.
• Signal Conditioning: Pull-up/pull-down resistor arrays for digital interfaces (I²C, SPI).
• Industrial Controls: Feedback networks in power supplies and motor drivers.
• Test & Measurement: Calibration circuits requiring tight tolerance and low drift.
• Telecom Infrastructure: Line termination and impedance matching in high-frequency PCBs.

Conclusion of GS8B018250DCT

The GS8B018250DCT excels in applications demanding high precision, thermal stability, and compact form factors. Its ceramic construction and thin-film resistors provide superior performance over polymer-based networks, while the bussed design simplifies PCB layout. Though not automotive-grade, it is a cost-effective solution for industrial, telecom, and instrumentation designs. Engineers will appreciate its tight tolerances, low TCR, and robust packaging, making it a reliable choice for critical circuits.