TT Electronics/IRC

GS8B018250FCT

GS8B018250FCT Description

The GS8B018250FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 825Ω resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.25%. Built with thin-film technology, it ensures stable performance across a wide temperature range of -70°C to +125°C, with a temperature coefficient of ±100ppm/°C. The SOIC-C series package provides robust mechanical and thermal stability, making it suitable for demanding environments. With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, this network is ideal for high-density PCB designs requiring reliable signal conditioning or voltage division.

GS8B018250FCT Features

• Ceramic substrate for enhanced thermal and mechanical durability.
• Thin-film technology ensures low noise and high precision.
• Bussed network configuration simplifies circuit design for common bus applications.
• 1% absolute tolerance and ±0.25% ratio tolerance for critical accuracy.
• Wide operating temperature range (-70°C to +125°C) with derated power up to 125°C.
• Gull-wing termination for reliable surface-mount assembly.
• Compact SOIC-16 package (9.91mm × 5.99mm × 1.45mm) with tight dimensional tolerances.
• Non-automotive, non-PPAP compliant, suited for industrial and commercial use.

GS8B018250FCT Applications

This resistor network excels in applications requiring precision resistance matching and thermal stability, such as:

• Analog signal processing in test and measurement equipment.
• Voltage dividers and pull-up/pull-down networks in digital systems.
• Feedback and gain control circuits in amplifiers and sensors.
• Industrial automation systems where consistent performance under thermal stress is critical.
• Medical electronics demanding high reliability and low drift.

Conclusion of GS8B018250FCT

The GS8B018250FCT stands out for its ceramic construction, thin-film precision, and robust SOIC packaging, making it a superior choice for engineers designing high-reliability circuits. Its bussed architecture, tight tolerances, and wide temperature range ensure consistent performance in industrial, medical, and instrumentation applications. While not automotive-grade, its low thermal drift and high power density make it a versatile solution for demanding electronic systems.