TT Electronics/IRC

GS8B018872GGT

GS8B018872GGT Description

The GS8B018872GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 16-pin narrow SOIC (SOIC-C) format, this bussed resistor array integrates 15 thin-film resistors with a common bus connection, offering a resistance value of 88.7KΩ and a tight absolute tolerance of ±2%. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating range of -55°C to +125°C, with derated power handling up to 125°C. The 0.05W (1/20W) power rating per resistor and 0.8W total power rating make it suitable for low-power, high-density designs.

GS8B018872GGT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers precision and low noise.
• Bussed network topology simplifies circuit design for common voltage division or pull-up/down applications.
• Gull-wing termination ensures reliable surface-mount (SMD) assembly.
• 100V maximum voltage rating and 2% tolerance for robust performance.
• Compact dimensions (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-automotive grade (PPAP: No) but ideal for industrial and telecom applications.

GS8B018872GGT Applications

This resistor network excels in:

• Voltage divider circuits in precision analog systems.
• Pull-up/pull-down networks for digital logic interfaces (e.g., I²C, SPI).
• Signal conditioning in sensor arrays and measurement equipment.
• Embedded systems requiring space-efficient, high-reliability passive components.
• Power management modules where stable resistance under thermal stress is critical.

Conclusion of GS8B018872GGT

The GS8B018872GGT stands out for its ceramic construction, thin-film accuracy, and bussed design, offering engineers a reliable solution for space-constrained, precision applications. While not RoHS-compliant, its wide temperature range and low TCR make it a preferred choice for industrial and telecom designs. Its SOIC package ensures compatibility with automated assembly processes, reducing manufacturing costs. For designs demanding stable resistance ratios and minimal drift, this network is a compelling option.