TT Electronics/IRC

GS8B019092GFT

GS8B019092GFT Description

The GS8B019092GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 resistors with a 90.9KΩ resistance value and a tight ±2% absolute tolerance (±1% ratio tolerance). Its thin-film technology ensures stable performance across a wide temperature range (70°C to 125°C), with a low ±100ppm/°C temperature coefficient. The device offers a 0.8W total power rating (0.05W per resistor) and supports 100V maximum voltage, making it suitable for high-reliability applications.

GS8B019092GFT Features

• Robust Construction: Ceramic substrate enhances thermal stability and durability.
• Precision Performance: ±2% tolerance and ±100ppm/°C TCR ensure accuracy in critical circuits.
• Space-Efficient Design: 9.91mm × 5.99mm × 1.45mm SOIC package with 1.27mm pitch gull-wing leads for compact PCB layouts.
• High Power Handling: 0.8W total dissipation (0.05W per resistor) derated up to 125°C.
• Bussed Configuration: Simplifies circuit design by connecting multiple resistors to a common node (BUS).
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications where PPAP compliance is not required.

GS8B019092GFT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision attenuation in ADC/DAC circuits.
• Signal Conditioning: Stable performance in sensor interfaces and feedback loops.
• Industrial Control Systems: Reliable operation in PLCs and power management modules.
• Telecommunication Equipment: Impedance matching and filtering in RF/analog circuits.
• Test & Measurement Devices: Low-drift performance for calibration and reference circuits.

Conclusion of GS8B019092GFT

The GS8B019092GFT combines precision, compactness, and thermal resilience, making it a superior choice for engineers seeking reliable resistor networks in non-automotive, high-temperature environments. Its bussed architecture reduces component count, while thin-film technology ensures long-term stability. While not RoHS-compliant, its ceramic construction and SOIC packaging offer a robust solution for industrial and telecom applications demanding tight tolerances and low thermal drift.