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GS8B019530CCT
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GS8B019530CCT Description
GS8B019530CCT Description
The GS8B019530CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 953Ω resistance value and an exceptional ±0.25% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers a ±100ppm/°C temperature coefficient, stable operation across a 70°C to 125°C derated power range, and a maximum operating temperature of 125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations enables easy surface-mount assembly, while its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage environments.
GS8B019530CCT Features
- High Precision: ±0.25% tolerance and ±0.25% ratio tolerance for accurate signal conditioning.
- Robust Construction: Ceramic case ensures durability and thermal stability.
- Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
- Thin-Film Technology: Delivers low noise and stable performance.
- Compact SOIC Package: Space-saving 16-pin narrow SOIC (9.91mm x 5.99mm) with 1.27mm terminal pitch.
- Bussed Network: Simplifies circuit design with 15 interconnected resistors.
- Surface-Mount Ready: Gull-wing terminations for automated PCB assembly.
GS8B019530CCT Applications
This resistor network is ideal for:
- Precision analog circuits requiring tight tolerance and low drift.
- Signal conditioning in industrial sensors and measurement equipment.
- Voltage dividers and pull-up networks in communication systems.
- Automotive electronics (non-automotive grade but suitable for benign environments).
- Medical devices where stability and accuracy are critical.
Conclusion of GS8B019530CCT
The GS8B019530CCT stands out for its high precision, ceramic durability, and thin-film reliability, making it a top choice for engineers designing low-power, high-accuracy circuits. Its bussed configuration reduces component count, while the SOIC package ensures compatibility with standard assembly processes. While not PPAP or automotive-qualified, it excels in industrial, medical, and communication applications demanding stable performance under varying thermal conditions.



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