TT Electronics/IRC

GS8B019532DAT

GS8B019532DAT Description

The GS8B019532DAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed thin-film resistors with a 95.3 kΩ resistance value and an exceptional ±0.5% absolute tolerance (±0.05% ratio tolerance). The device operates over a wide temperature range of -70°C to +125°C, with a ±100 ppm/°C temperature coefficient, ensuring stability in harsh environments. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction offers robust ceramic case durability, while gull-wing termination ensures reliable PCB mounting.

GS8B019532DAT Features

• High Precision: ±0.5% absolute tolerance (±0.05% ratio tolerance) for critical signal conditioning.
• Robust Construction: Ceramic case (SOIC package) with thin-film technology for thermal and mechanical resilience.
• Wide Operating Range: -70°C to +125°C with derated power up to 125°C.
• Low TCR: ±100 ppm/°C ensures minimal resistance drift.
• Bussed Network: 15 resistors with a common BUS designator, simplifying circuit layout.
• Surface-Mount Ready: Gull-wing terminals (1.27mm pitch) for automated assembly.
• Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).

GS8B019532DAT Applications

• Precision Voltage Dividers: Ideal for ADC/DAC reference networks due to low ratio tolerance.
• Industrial Controls: Stable performance in PLCs, sensor interfaces, and instrumentation.
• Automotive Electronics: Despite non-automotive PPAP status, suitable for non-safety-critical modules.
• Medical Devices: Reliable operation in diagnostic equipment where accuracy is paramount.
• Telecom Hardware: Signal conditioning in RF and baseband circuits.

Conclusion of GS8B019532DAT

The GS8B019532DAT excels in high-accuracy, space-constrained designs, offering superior thermal stability and mechanical robustness compared to polymer-based networks. Its ceramic SOIC package and thin-film technology provide long-term reliability in industrial, medical, and telecom systems. While not PPAP-capable, its tight tolerances and low TCR make it a cost-effective choice for precision applications where component consistency is critical. Engineers will value its ease of integration and performance consistency across temperature extremes.