TT Electronics/IRC

GS8B019760JFT

GS8B019760JFT Description

The GS8B019760JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors, each with a 976Ω resistance value and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in harsh environments. Its ±100ppm/°C temperature coefficient and ±1% ratio tolerance make it ideal for applications requiring stable performance under thermal stress. The 0.05W (1/20) power rating per resistor and 0.8W total power rating provide efficient power dissipation, while the 100V maximum voltage rating ensures robust operation in high-voltage circuits.

GS8B019760JFT Features

• Ceramic case for enhanced thermal stability and durability.
• Thin-film technology delivers precise resistance values and low noise.
• Gull-wing termination for reliable surface-mount (SMD) assembly.
• Compact SOIC package (9.91mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• Bussed network design simplifies circuit layout for common-bus applications.
• Wide operating temperature range (-70°C to +125°C) suits automotive, industrial, and aerospace use.
• Non-compliant with EU RoHS, making it suitable for legacy or exempted applications.

GS8B019760JFT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight ratio tolerance (±1%).
• Signal conditioning in industrial control systems and instrumentation.
• Bus termination for digital communication interfaces (e.g., CAN, SPI).
• Power supply feedback networks where stability across temperature is critical.
• Legacy electronics or military/aerospace systems needing non-RoHS components.

Conclusion of GS8B019760JFT

The GS8B019760JFT stands out for its ceramic construction, precision thin-film resistors, and robust SOIC packaging, making it a reliable choice for high-stability applications. Its bussed architecture reduces component count in bus-oriented designs, while the wide temperature range ensures performance in extreme conditions. Though not RoHS-compliant, it remains invaluable for specialized or exempted industries. Engineers will appreciate its balance of accuracy, power handling, and compact form factor, particularly in analog signal chains and power management systems.