TT Electronics/IRC

GS8B021001JFT

GS8B021001JFT Description

The GS8B021001JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values in compact form factors. This 16-pin Narrow SOIC (SOIC-C Series) device integrates 15 bussed resistors with a 1KΩ value, offering an absolute tolerance of ±5% and a ratio tolerance of ±1%. Built with thin-film technology, it ensures low noise and high reliability, with a temperature coefficient of ±50ppm/°C for minimal resistance drift across its operating range of 70°C to 125°C. The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while its 100V maximum voltage rating accommodates moderate voltage applications.

GS8B021001JFT Features

• Ceramic Construction: Enhances thermal stability and durability in harsh environments.
• Bussed Network (BUS): Simplifies circuit design by connecting multiple resistors in a shared configuration.
• Thin-Film Technology: Delivers superior accuracy (±5%) and low TCR (±50ppm/°C) compared to thick-film alternatives.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Gull Wing Termination: Ensures reliable surface-mount (SMD) assembly compatibility.
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications where PPAP compliance is not required.

GS8B021001JFT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and pull-up/pull-down networks in analog/digital circuits.
• Industrial Control Systems: Stable resistance for sensor interfaces and feedback loops.
• Telecommunications Equipment: Impedance matching and termination in high-frequency PCBs.
• Test & Measurement Devices: Low-drift performance for calibration circuits.
• Power Management: Auxiliary circuits in DC-DC converters where space and stability are critical.

Conclusion of GS8B021001JFT

The GS8B021001JFT stands out for its ceramic substrate, thin-film precision, and compact SOIC footprint, making it a robust choice for applications demanding thermal stability and space efficiency. While not RoHS-compliant, its bussed design and tight tolerances simplify board layout and reduce component count. Engineers will appreciate its balance of performance, reliability, and cost-effectiveness in non-automotive industrial and telecom systems.