
TT Electronics/IRC
GS8B021020FFT
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GS8B021020FFT Description
GS8B021020FFT Description
The GS8B021020FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed (BUS) network integrates 15 thin-film resistors, each with a 102Ω resistance and a tight ±1% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for industrial and automotive-grade designs (though not PPAP or Automotive-compliant). The 0.05W (1/20) power rating per resistor and 0.8W total power dissipation balance compactness with reliability, while the 100V maximum voltage rating supports robust circuit protection.
GS8B021020FFT Features
- Ceramic Case & Thin-Film Technology: Delivers superior thermal stability and low noise, ideal for precision analog/digital circuits.
- High-Density Integration: 15 resistors in a compact 9.91×5.99×1.45mm SOIC package with gull-wing termination for easy surface mounting.
- Strict Tolerances: ±1% absolute and ratio tolerance ensures consistent performance in voltage dividers or bus terminations.
- Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power at elevated temperatures.
- Non-RoHS Compliant: Suitable for legacy or niche applications requiring non-compliant materials.
GS8B021020FFT Applications
- Voltage Divider Networks: Precision signal conditioning in sensor interfaces or ADCs.
- Bus Termination: Impedance matching in high-speed digital systems (e.g., memory modules).
- Industrial Control Systems: Stable performance in harsh environments (e.g., PLCs, motor drives).
- Test & Measurement Equipment: Low-drift resistance networks for calibration circuits.
Conclusion of GS8B021020FFT
The GS8B021020FFT stands out for its ceramic construction, tight tolerances, and thermal resilience, offering engineers a reliable solution for space-constrained, precision applications. While not suited for automotive use, its SOIC packaging and bussed design simplify PCB layout in industrial and instrumentation designs. For projects demanding stable, high-density resistance networks, this model provides an optimal blend of performance and durability.



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