TT Electronics/IRC

GS8B021102FDT

GS8B021102FDT Description

The GS8B021102FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 11 kΩ resistance value and a tight ±1% absolute tolerance. Its thin-film technology ensures stable performance with a low ±50 ppm/°C temperature coefficient, making it suitable for environments with operating temperatures up to 125°C. The 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable operation in compact circuits. With a 100V maximum voltage rating and gull-wing termination, it is optimized for surface-mount assembly in space-constrained designs.

GS8B021102FDT Features

• Ceramic case for enhanced thermal stability and durability.
• Bussed network topology simplifies circuit design by connecting multiple resistors in a single package.
• 1.27mm terminal pitch and SOIC footprint ensure compatibility with standard PCB layouts.
• ±0.5% ratio tolerance for matched resistor performance in differential circuits.
• Non-compliant with EU RoHS, indicating specific material considerations for industrial use.
• Tube packaging for secure handling and automated assembly.
• 70–125°C derated power range ensures consistent performance under thermal stress.

GS8B021102FDT Applications

This resistor network excels in precision analog circuits, voltage dividers, and signal conditioning where tight tolerance and thermal stability are critical. Its bussed configuration is ideal for bus termination, pull-up/pull-down networks, and digital logic interfaces. The SOIC package suits automotive sensors (non-AECQ qualified), industrial control systems, and test/measurement equipment. Its low TCR and high-voltage tolerance make it a robust choice for power supply feedback networks and medical instrumentation.

Conclusion of GS8B021102FDT

The GS8B021102FDT combines high-density integration, precision thin-film resistors, and industrial-grade reliability in a compact SOIC package. Its bussed architecture reduces component count, while ±50 ppm/°C TCR ensures stability across temperature fluctuations. Though not RoHS-compliant, it remains a top choice for non-consumer applications demanding tight tolerances and robust performance. Engineers will value its ease of assembly and consistent electrical characteristics in mission-critical designs.