TT Electronics/IRC_GS8B021102GCT
original

TT Electronics/IRC
GS8B021102GCT

50-GS8B021102GCT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,16-Pin Narrow SOIC, Bussed elements,±50ppm/°C, 11KOhm, absolute tolerance ±2%, ratio tolerance ±0.25%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
15
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS8B021102GCT Description

GS8B021102GCT Description

The GS8B021102GCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 11 kΩ resistance value and a tight ±2% absolute tolerance. Its ±50 ppm/°C temperature coefficient ensures stable performance across a wide operating range of -55°C to +125°C, making it suitable for environments with thermal fluctuations. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating provide reliable operation in low-power, high-voltage scenarios.

GS8B021102GCT Features

  • Ceramic substrate for enhanced thermal stability and durability.
  • Thin-film technology delivers superior precision and low noise.
  • Bussed (common bus) configuration simplifies circuit design for shared voltage applications.
  • Narrow SOIC (5.99mm × 9.91mm) footprint saves PCB space while supporting surface-mount (Gull Wing) assembly.
  • ±0.25% ratio tolerance ensures matched resistor performance for differential signaling or voltage division.
  • Non-automotive grade with EAR99 ECCN, ideal for industrial, telecom, and instrumentation use.
  • Non-RoHS compliant (contains lead), suitable for legacy or high-reliability systems.

GS8B021102GCT Applications

This resistor network excels in:

  • Analog signal conditioning (e.g., sensor interfaces, ADC/DAC circuits).
  • Voltage division networks in precision measurement equipment.
  • Bus termination for digital communication lines (e.g., SPI, I²C).
  • Industrial control systems requiring stable resistance under thermal stress.
  • Legacy electronics repair where leaded components are mandated.

Conclusion of GS8B021102GCT

The GS8B021102GCT combines ceramic ruggedness, thin-film accuracy, and compact SOIC packaging to address critical design challenges in precision electronics. Its bussed architecture and low TCR (±50ppm/°C) make it a standout choice for engineers prioritizing thermal stability and space efficiency. While not suited for automotive or RoHS-compliant designs, it remains a robust solution for industrial, telecom, and high-reliability applications where performance outweighs regulatory restrictions.

FAQ

What is the standard lead time for GS8B021102GCT?
The standard lead time for GS8B021102GCT is 30 weeks.
What package or case is GS8B021102GCT available in?
What is GS8B021102GCT?
What operating temperature range does GS8B021102GCT support?
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