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GS8B021102GCT
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GS8B021102GCT Description
GS8B021102GCT Description
The GS8B021102GCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 11 kΩ resistance value and a tight ±2% absolute tolerance. Its ±50 ppm/°C temperature coefficient ensures stable performance across a wide operating range of -55°C to +125°C, making it suitable for environments with thermal fluctuations. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating provide reliable operation in low-power, high-voltage scenarios.
GS8B021102GCT Features
- Ceramic substrate for enhanced thermal stability and durability.
- Thin-film technology delivers superior precision and low noise.
- Bussed (common bus) configuration simplifies circuit design for shared voltage applications.
- Narrow SOIC (5.99mm × 9.91mm) footprint saves PCB space while supporting surface-mount (Gull Wing) assembly.
- ±0.25% ratio tolerance ensures matched resistor performance for differential signaling or voltage division.
- Non-automotive grade with EAR99 ECCN, ideal for industrial, telecom, and instrumentation use.
- Non-RoHS compliant (contains lead), suitable for legacy or high-reliability systems.
GS8B021102GCT Applications
This resistor network excels in:
- Analog signal conditioning (e.g., sensor interfaces, ADC/DAC circuits).
- Voltage division networks in precision measurement equipment.
- Bus termination for digital communication lines (e.g., SPI, I²C).
- Industrial control systems requiring stable resistance under thermal stress.
- Legacy electronics repair where leaded components are mandated.
Conclusion of GS8B021102GCT
The GS8B021102GCT combines ceramic ruggedness, thin-film accuracy, and compact SOIC packaging to address critical design challenges in precision electronics. Its bussed architecture and low TCR (±50ppm/°C) make it a standout choice for engineers prioritizing thermal stability and space efficiency. While not suited for automotive or RoHS-compliant designs, it remains a robust solution for industrial, telecom, and high-reliability applications where performance outweighs regulatory restrictions.



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