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GS8B021130JDT
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GS8B021130JDT Description
GS8B021130JDT Description
The GS8B021130JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values under varying thermal conditions. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 thin-film resistors with a common resistance value of 113Ω and a ±5% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures minimal resistance drift across the 70°C to 125°C operating range, making it suitable for environments with fluctuating temperatures. The device features gull-wing terminations for reliable surface-mount (SMD) assembly and is housed in a rectangular ceramic case with dimensions of 9.91mm (L) × 5.99mm (D) × 1.45mm (H). Rated for 100V maximum voltage and 0.8W total power dissipation, it offers robust performance in compact designs.
GS8B021130JDT Features
- High-Density Integration: 15 resistors in a 16-pin SOIC package, optimizing PCB space.
- Stable Thin-Film Technology: Delivers ±50ppm/°C thermal stability and ±0.5% ratio tolerance for precision signal conditioning.
- Rugged Ceramic Construction: Enhances durability and heat dissipation vs. polymer-based networks.
- Wide Operating Range: Functions reliably from -55°C to 125°C (derated power above 70°C).
- Automation-Friendly: 1.27mm terminal pitch and gull-wing leads simplify pick-and-place assembly.
- Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications.
GS8B021130JDT Applications
- Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC front-ends.
- Bus Termination: Impedance matching for high-speed digital buses (e.g., SPI, I²C).
- Medical Electronics: Stable resistance in patient monitoring equipment where thermal drift is critical.
- Test & Measurement: Calibration circuits requiring low TCR (temperature coefficient of resistance).
- Power Supply Feedback: Current sensing or feedback loops in DC-DC converters.
Conclusion of GS8B021130JDT
The GS8B021130JDT excels in applications demanding compact footprint, thermal stability, and tight tolerance ratios. Its ceramic SOIC package and thin-film technology provide superior reliability over epoxy-based networks, particularly in high-temperature or high-voltage scenarios. While not PPAP-qualified for automotive use, it is a cost-effective solution for industrial controls, communication hardware, and precision analog circuits. Engineers will value its balance of performance, density, and ease of integration in space-constrained designs.



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