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GS8B021181FBT
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GS8B021181FBT Description
GS8B021181FBT Description
The GS8B021181FBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed (BUS) network integrates 15 thin-film resistors, each with a 1.18 kΩ resistance and a tight ±1% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±50 ppm/°C temperature coefficient and ±0.1% ratio tolerance make it ideal for applications requiring stable, matched resistances. The SOIC-C series construction features a ceramic case, gull-wing termination, and a compact footprint (9.91 x 5.99 x 1.45 mm), suitable for high-density PCB designs.
GS8B021181FBT Features
- Precision Performance: Thin-film technology delivers ±1% tolerance and ±0.1% ratio tolerance for matched resistance networks.
- Robust Construction: Ceramic case ensures durability and thermal stability, with a 125°C maximum operating temperature.
- High Power Handling: 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating.
- Space-Efficient Design: SOIC package (9.91 mm length, 1.27 mm pitch) optimizes board space in compact layouts.
- Wide Temperature Range: Operates from -70°C to +125°C, with derated power at elevated temperatures.
- Stable TCR: ±50 ppm/°C ensures minimal resistance drift over temperature variations.
GS8B021181FBT Applications
This resistor network excels in precision analog and digital circuits, including:
- Voltage dividers and signal conditioning in industrial sensors.
- Feedback networks for op-amps and ADCs/DACs.
- Impedance matching in communication systems.
- Power supply regulation and current-limiting applications.
- Automotive and aerospace electronics (though not PPAP/automotive-qualified, its rugged ceramic construction suits harsh environments).
Conclusion of GS8B021181FBT
The GS8B021181FBT stands out for its precision, thermal stability, and compact form factor, making it a superior choice for engineers designing high-reliability circuits. Its thin-film technology, tight tolerances, and ceramic encapsulation provide long-term performance in industrial, telecom, and instrumentation applications. While not RoHS-compliant, its robust electrical characteristics justify its use in specialized scenarios where accuracy and durability are critical.



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