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GS8B021330FFT
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GS8B021330FFT Description
GS8B021330FFT Description
The GS8B021330FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 133Ω resistance value, offering ±1% absolute tolerance and ±1% ratio tolerance. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C) and delivers a power rating of 0.8W (0.05W per resistor). The SOIC package with gull-wing termination enables reliable surface-mount assembly, while its ±50ppm/°C temperature coefficient guarantees minimal resistance drift. Ideal for high-density PCB designs, this network is engineered for signal conditioning, voltage division, and impedance matching in demanding environments.
GS8B021330FFT Features
- Ceramic substrate for enhanced thermal stability and durability.
- 15 bussed resistors in a 16-pin SOIC package, optimizing space efficiency.
- Thin-film technology ensures low noise and high precision (±1% tolerance).
- Wide operating range: -55°C to +125°C (derated power up to 125°C).
- Low TCR (±50ppm/°C) for consistent performance under thermal stress.
- Gull-wing leads for robust surface-mount (SMD) compatibility.
- High voltage rating (100V) and 0.8W total power dissipation.
- Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
GS8B021330FFT Applications
- Industrial automation: Precision signal conditioning in PLCs and sensors.
- Telecommunications: Impedance matching in RF and baseband circuits.
- Medical devices: Stable resistor networks for diagnostic equipment.
- Automotive electronics (non-automotive grade): Auxiliary systems requiring thermal resilience.
- Test & measurement: Calibration and reference circuits demanding low drift.
Conclusion of GS8B021330FFT
The GS8B021330FFT stands out for its ceramic construction, thin-film accuracy, and compact SOIC footprint, making it a superior choice for high-reliability applications. While not PPAP or automotive-qualified, its low TCR, tight tolerances, and robust power handling cater to industrial, medical, and telecom needs. Engineers will appreciate its balance of performance and space-saving design, particularly in dense PCB layouts where precision and thermal management are critical.



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