TT Electronics/IRC

GS8B021690GT

GS8B021690GT Description

The GS8B021690GT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C Series), it features 15 bussed resistors with a 169Ω resistance value and a tight ±2% tolerance. Built using thin-film technology, it delivers excellent stability with a ±50ppm/°C temperature coefficient, ensuring reliable performance across a -70°C to +125°C operating range. The network supports a maximum voltage rating of 100V and offers a power rating of 0.8W (0.05W per resistor), making it suitable for demanding circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B021690GT Features

• Ceramic substrate for enhanced thermal and mechanical stability.
• Bussed configuration simplifies circuit design by connecting multiple resistors in a single package.
• Low TCR (±50ppm/°C) ensures minimal resistance drift under temperature fluctuations.
• High power density (0.8W total, 0.05W per resistor) in a compact 9.91mm × 5.99mm × 1.45mm footprint.
• Narrow SOIC (SOIC-C) package with 1.27mm terminal pitch for space-constrained layouts.
• Non-automotive grade with PPAP: No, ideal for industrial and commercial applications.
• Non-RoHS compliant, suitable for legacy or specialized systems.

GS8B021690GT Applications

This resistor network excels in:

• Voltage divider circuits and bus termination in communication hardware.
• Signal conditioning for sensors and analog front-end modules.
• Power supply decoupling and load balancing in embedded systems.
• Industrial control systems requiring stable, high-density resistor arrays.
• Test and measurement equipment where precision and thermal stability are critical.

Conclusion of GS8B021690GT

The GS8B021690GT stands out for its ceramic construction, bussed topology, and thin-film precision, offering superior reliability in harsh environments. While not suited for automotive use, its high power rating, tight tolerance, and compact SOIC package make it a versatile choice for industrial, telecom, and instrumentation designs. Engineers will appreciate its balance of performance and integration ease, reducing board space and assembly complexity.