TT Electronics/IRC

GS8B021741CT

GS8B021741CT Description

The GS8B021741CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors, each with a 1.74 kΩ resistance and an exceptional ±0.25% tolerance. The device operates over a wide temperature range of 70°C to 125°C with a ±50 ppm/°C temperature coefficient, ensuring stability in fluctuating environments. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it combines reliability with compact surface-mount (SOIC) packaging (9.91mm × 5.99mm × 1.45mm). Its gull-wing termination and ±0.1mm height/length tolerances facilitate precise PCB integration.

GS8B021741CT Features

• High Precision: ±0.25% absolute tolerance and ±50 ppm/°C TCR for critical analog/digital circuits.
• Robust Construction: Ceramic substrate and thin-film technology enhance thermal performance and longevity.
• Space-Efficient: 16-pin SOIC package (9.91mm × 5.99mm) ideal for high-density PCBs.
• Bussed Design: Simplified routing for common bus applications (e.g., voltage dividers, pull-up networks).
• Wide Operating Range: -70°C to +125°C derated power range, suitable for industrial environments.
• Non-Automotive: Compliant with EAR99 but not PPAP-capable or RoHS-compliant.

GS8B021741CT Applications

• Precision Instrumentation: Signal conditioning, ADC/DAC reference networks.
• Industrial Controls: PLCs, sensor interfaces requiring stable resistance under thermal stress.
• Telecommunications: Impedance matching and termination in high-frequency modules.
• Power Management: Voltage dividers in DC-DC converters or feedback loops.
• Legacy Systems: Maintenance/upgrades where ceramic reliability offsets RoHS non-compliance.

Conclusion of GS8B021741CT

The GS8B021741CT excels in precision and durability, offering low TCR and tight tolerance in a compact SOIC format. While unsuitable for automotive or RoHS-mandated designs, its ceramic substrate and bussed architecture make it a standout for industrial, telecom, and instrumentation applications requiring stable performance under thermal and electrical stress. Engineers will value its repeatability and space-saving profile for high-density layouts.