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GS8B021742FT
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GS8B021742FT Description
GS8B021742FT Description
The GS8B021742FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin Narrow SOIC device features 15 bussed resistors with a 17.4KΩ resistance value and a tight ±1% tolerance, ensuring reliable signal integrity in demanding circuits. Built with thin-film technology, it offers excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The SOIC package (9.91mm x 5.99mm x 1.45mm) provides a compact footprint, ideal for space-constrained designs. Rated for 100V maximum voltage and 0.8W total power dissipation, it operates across a wide temperature range (-70°C to +125°C), though derating is required above 70°C.
GS8B021742FT Features
- Bussed Network Configuration: Simplifies PCB layout by reducing discrete component count.
- High Precision: 1% tolerance and ±50ppm/°C TCR ensure consistent performance.
- Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
- Surface-Mount Design: Gull-wing terminals (1.27mm pitch) enable reliable automated assembly.
- Wide Operating Range: Supports -70°C to +125°C, derated beyond 70°C.
- Low Power Dissipation: 0.05W per resistor (1/20W) balances efficiency and thermal management.
GS8B021742FT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
- Industrial Control Systems: Stable resistance paths in PLCs and motor drives.
- Automotive Electronics: Non-automotive grade but suitable for benign environments (e.g., infotainment).
- Test & Measurement Equipment: Calibration circuits requiring low drift.
- Power Management: Bus termination and pull-up/down networks in DC-DC converters.
Conclusion of GS8B021742FT
The GS8B021742FT combines precision, compactness, and reliability, making it a standout choice for bussed resistor networks. Its ceramic thin-film construction and tight tolerances cater to applications demanding long-term stability under thermal stress. While not PPAP or automotive-qualified, it is ideal for industrial, telecom, and instrumentation designs where space and performance are critical. Engineers will appreciate its ease of integration and robust electrical characteristics, reducing BOM complexity without compromising quality.



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