


TT Electronics/IRC
GS8B021742GGT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS8B021742GGT Description
GS8B021742GGT Description
The GS8B021742GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 17.4KΩ resistance value and a tight ±2% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for industrial and instrumentation applications. The SOIC-C series construction features a ceramic case for enhanced thermal and mechanical reliability, with a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W.
GS8B021742GGT Features
- High Precision: ±2% tolerance and ±50ppm/°C TCR for consistent performance.
- Robust Construction: Ceramic substrate and gull-wing termination for durability in surface-mount applications.
- Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
- Wide Voltage Range: Supports up to 100V maximum voltage rating.
- Thermal Stability: Derated power up to 125°C ensures reliability in high-temperature environments.
- Non-Automotive: Ideal for industrial, telecom, and test equipment where PPAP compliance is not required.
GS8B021742GGT Applications
This resistor network excels in:
- Signal conditioning and voltage division in precision analog circuits.
- Industrial control systems requiring stable resistance under thermal stress.
- Medical instrumentation where low drift and high accuracy are critical.
- Telecommunication hardware for impedance matching and filtering.
- Test & measurement equipment demanding repeatable performance.
Conclusion of GS8B021742GGT
The GS8B021742GGT stands out for its ceramic-based thin-film technology, offering superior thermal and electrical stability compared to polymer-based networks. Its bussed configuration simplifies PCB layout, while the SOIC package ensures compatibility with automated assembly processes. Though not RoHS-compliant, it remains a top choice for non-consumer applications prioritizing precision and ruggedness. Engineers will appreciate its balance of performance, compactness, and reliability in critical circuits.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










