TT Electronics/IRC

GS8B021801BT

GS8B021801BT Description

The GS8B021801BT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring tight tolerance and stability. Housed in a 16-pin narrow SOIC package, this bussed (BUS) network integrates 15 thin-film resistors, each rated at 1.8KΩ with an absolute tolerance of ±0.1%. The device operates over a wide temperature range (-70°C to +125°C) and features a low temperature coefficient (±50ppm/°C), ensuring minimal resistance drift. With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, it is engineered for reliability in precision circuits. The SOIC-C series construction offers robust ceramic substrate and gull-wing termination, making it suitable for automated surface-mount assembly.

GS8B021801BT Features

• High Precision: ±0.1% tolerance and ±50ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case with thin-film technology for durability and thermal stability.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint in a 16-pin SOIC package.
• Bussed Configuration: Simplifies circuit design by interconnecting resistors.
• Wide Operating Range: Derated power up to 125°C, ideal for harsh environments.
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for easy PCB integration.

GS8B021801BT Applications

This resistor network excels in precision analog and digital systems, including:

• Voltage dividers and current sensing in industrial controls.
• Signal conditioning for sensors and instrumentation.
• Medical electronics requiring high stability and low drift.
• Automotive test systems (though not PPAP/AEC-Q200 qualified).
• Communication infrastructure where tight tolerances are critical.

Conclusion of GS8B021801BT

The GS8B021801BT stands out for its exceptional accuracy, thermal performance, and compact design, making it a top choice for engineers prioritizing reliability in precision circuits. Its ceramic substrate and thin-film technology offer superior stability over polymer-based alternatives, while the bussed architecture reduces component count. Though not RoHS-compliant, it remains a robust solution for industrial, medical, and test equipment applications where performance outweighs regulatory constraints.