TT Electronics/IRC

GS8B021821JFT

GS8B021821JFT Description

The GS8B021821JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin Narrow SOIC package features 15 bussed resistors with a 1.82KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in voltage division and signal conditioning. The thin-film technology provides excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. With a power rating of 0.8W (0.05W per resistor) and a maximum operating temperature of 125°C, this component is engineered for durability in surface-mount applications.

GS8B021821JFT Features

• Ceramic case (SOIC package) for robust thermal and mechanical performance.
• Bussed network topology simplifies circuit design by connecting multiple resistors in a single package.
• Thin-film technology ensures low noise, high accuracy (±1% ratio tolerance), and long-term stability.
• Gull-wing termination for reliable surface-mount assembly.
• Wide temperature range (70°C to 125°C @ derated power) for industrial and automotive-grade reliability (though not PPAP/automotive certified).
• Compact dimensions (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• 100V maximum voltage rating for medium-voltage applications.

GS8B021821JFT Applications

Ideal for precision analog circuits, this resistor network excels in:

• Voltage dividers and pull-up/pull-down networks in embedded systems.
• Signal conditioning for sensors and ADCs/DACs.
• Industrial control systems requiring stable resistance under thermal stress.
• Consumer electronics where space-saving SMD components are critical.
• Test and measurement equipment demanding tight tolerance ratios (±1%).

Conclusion of GS8B021821JFT

The GS8B021821JFT combines high-density integration, thermal resilience, and electrical precision in a compact SOIC format. Its ceramic construction and thin-film technology offer superior performance over carbon-based networks, while the bussed design reduces PCB footprint and assembly complexity. Though not RoHS-compliant or automotive-rated, it remains a cost-effective solution for industrial and commercial applications requiring stable, low-drift resistance networks. Engineers will appreciate its balance of accuracy, power handling, and space efficiency in critical circuit designs.