TT Electronics/IRC

GS8B021961CT

GS8B021961CT Description

The GS8B021961CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 1.96KΩ resistance value and an exceptional ±0.25% tolerance. Its ±50ppm/°C temperature coefficient ensures stability across a wide operating temperature range of 70°C to 125°C, making it suitable for environments with thermal fluctuations. The device features a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, with a maximum voltage rating of 100V. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances durability and heat dissipation.

GS8B021961CT Features

• Precision Performance: Ultra-tight ±0.25% tolerance and ±50ppm/°C TCR for high-accuracy applications.
• Robust Construction: Ceramic SOIC package ensures thermal stability and mechanical strength.
• High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm footprint.
• Wide Operating Range: Reliable performance from 70°C to 125°C with derated power handling.
• Surface-Mount Ready: Gull-wing leads and 1.27mm terminal pitch for seamless SMT assembly.
• Low Power Dissipation: 0.05W per resistor minimizes heat buildup in dense layouts.

GS8B021961CT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and sensor signal conditioning in industrial controls.
• Feedback networks for op-amps and ADCs in test/measurement equipment.
• Impedance matching in high-frequency communication systems.
• Power supply regulation where stable resistance values are critical.
• Automotive subsystems (non-AECQ qualified) requiring robust thermal performance.

Conclusion of GS8B021961CT

The GS8B021961CT combines high precision, compact design, and thermal resilience, making it ideal for engineers seeking reliable resistor networks in space-constrained, thermally challenging applications. While not PPAP or automotive-qualified, its ceramic construction and thin-film technology offer superior performance over standard epoxy-based networks. Its bussed architecture simplifies circuit design, reducing component count and board footprint. For projects demanding tight tolerances and stable operation under thermal stress, this TT Electronics/IRC solution stands out as a high-performance choice.