TT Electronics/IRC

GS8B022200CT

GS8B022200CT Description

The GS8B022200CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC package integrates 15 bussed resistors, each with a 220Ω resistance and an ultra-tight ±0.25% tolerance. Built with thin-film technology, it delivers excellent stability with a low ±50ppm/°C temperature coefficient, ensuring reliable performance across a 70°C to 125°C operating range. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly. With a 100V maximum voltage rating and 0.05W (1/20W) power dissipation per resistor, it balances compactness (9.91mm × 5.99mm × 1.45mm) with robust electrical characteristics.

GS8B022200CT Features

• Precision Network: 15 bussed resistors at 220Ω ±0.25%, ideal for signal conditioning.
• Stable Thin Film: ±50ppm/°C TCR ensures minimal drift under thermal stress.
• High-Temperature Operation: Rated for 125°C max, derated up to 125°C.
• Compact SOIC Package: 16-pin narrow profile (9.91mm × 5.99mm) saves PCB space.
• Robust Construction: Ceramic substrate enhances durability and heat dissipation.
• Automation-Friendly: Gull-wing leads (1.27mm pitch) simplify pick-and-place assembly.
• Non-Automotive: Not PPAP-capable, suited for industrial/commercial use.

GS8B022200CT Applications

• Voltage Division & Pull-Up Networks: Precision bussing in ADC/DAC circuits.
• Signal Termination: Bus line impedance matching in communication hardware.
• Industrial Controls: Stable resistance in PLC I/O modules or sensor interfaces.
• Test & Measurement Equipment: High-accuracy networks for calibration circuits.
• Power Management: Load sharing in low-power DC/DC converters.

Conclusion of GS8B022200CT

The GS8B022200CT excels in applications requiring tight tolerance, thermal stability, and compact integration. Its ceramic thin-film design outperforms standard thick-film networks in precision-critical environments, while the SOIC footprint aligns with high-density PCB layouts. Though not automotive-grade, it is a cost-effective solution for industrial, telecom, and instrumentation designs where reliability and accuracy are paramount. Engineers will appreciate its balance of performance, size, and durability in mission-critical circuits.