TT Electronics/IRC

GS8B022261GBT

GS8B022261GBT Description

The GS8B022261GBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC (SOIC-C series) device integrates 15 bussed resistors with a 2.26KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable operation under moderate loads, while the 100V maximum voltage rating ensures durability in high-voltage circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B022261GBT Features

• Ceramic case for enhanced thermal and mechanical stability.
• Bussed network topology simplifies circuit design by connecting multiple resistors to a common node.
• SOIC package (9.91mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• Wide operating temperature range (70°C to 125°C derated, 125°C max).
• Low TCR (±50ppm/°C) minimizes resistance drift.
• Non-automotive, non-PPAP compliant, ideal for industrial and commercial applications.
• Non-EU RoHS status, suitable for legacy systems.

GS8B022261GBT Applications

This resistor network excels in:

• Voltage divider circuits requiring precise ratio matching (±0.1% ratio tolerance).
• Signal conditioning in analog/digital interfaces.
• Power supply feedback networks due to its stable thin-film construction.
• Industrial control systems where temperature resilience is critical.
• Test and measurement equipment demanding high accuracy and repeatability.

Conclusion of GS8B022261GBT

The GS8B022261GBT stands out for its ceramic-based robustness, precision tolerances, and bussed architecture, making it a superior choice for engineers needing reliable resistor networks in compact designs. While not suited for automotive use, its thermal stability and low TCR make it ideal for industrial, telecom, and instrumentation applications where consistent performance is paramount. Its SOIC footprint ensures compatibility with standard SMT assembly processes, streamlining production.