TT Electronics/IRC

GS8B022320FT

GS8B022320FT Description

The GS8B022320FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 232Ω resistance value, offering ±1% absolute tolerance and a ±50ppm/°C temperature coefficient. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C). The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while its 100V maximum voltage rating enhances reliability in demanding environments. The SOIC package (9.91mm × 5.99mm × 1.45mm) with gull-wing termination ensures compatibility with automated PCB assembly processes.

GS8B022320FT Features

• High Precision: ±1% tolerance and ±50ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Space-Efficient: Compact SOIC footprint (9.91mm × 5.99mm) ideal for dense PCB layouts.
• Automation-Friendly: Gull-wing terminals and 1.27mm pitch for seamless surface mounting.
• Wide Operating Range: Rated for -55°C to +125°C, derated at 70°C to 125°C.
• Bussed Configuration: Simplifies circuit design by connecting multiple resistors in a single network.

GS8B022320FT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision resistance matching for signal conditioning.
• Industrial Control Systems: Reliable performance in harsh environments.
• Consumer Electronics: Compact design for space-constrained devices.
• Automotive Electronics: Despite not being PPAP or automotive-qualified, its high-temperature resilience suits non-safety-critical automotive subsystems.
• Test & Measurement Equipment: Low TCR ensures accuracy over temperature fluctuations.

Conclusion of GS8B022320FT

The GS8B022320FT combines precision, durability, and compactness, making it ideal for applications demanding stable resistance in a small footprint. Its ceramic construction and thin-film technology provide superior thermal performance, while the bussed design simplifies PCB layout. Though not RoHS-compliant, it remains a cost-effective solution for industrial, consumer, and instrumentation markets where reliability and precision are paramount.