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GS8B022940JT
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GS8B022940JT Description
GS8B022940JT Description
The GS8B022940JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 16-pin narrow SOIC package features 15 bussed resistors with a 294Ω resistance value and a ±5% tolerance, ensuring reliable performance in circuit designs requiring consistent impedance matching. Its thin-film technology delivers excellent stability with a low ±50ppm/°C temperature coefficient, making it suitable for temperature-sensitive applications. The device operates within a wide temperature range of 70°C to 125°C and offers a maximum voltage rating of 100V, with a power rating of 0.8W (0.05W per resistor). The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations ensures easy surface-mount assembly.
GS8B022940JT Features
- High-Density Integration: 15 resistors in a compact 16-pin SOIC package, ideal for space-constrained PCB designs.
- Superior Thermal Performance: Ceramic substrate enhances heat dissipation, supporting operation up to 125°C.
- Precision Thin-Film Technology: Delivers ±50ppm/°C TCR for minimal resistance drift under thermal stress.
- Bussed Network Configuration: Simplifies bus line designs in digital and analog circuits.
- Robust Construction: ±0.1mm height/length tolerances ensure mechanical consistency for automated assembly.
- Non-Automotive Grade: Suitable for industrial and commercial applications where PPAP compliance is not required.
GS8B022940JT Applications
This resistor network excels in:
- Voltage Division Circuits: Precision ladder networks in ADCs/DACs.
- Bus Termination: Impedance matching for high-speed data lines (e.g., SPI, I²C).
- Sensor Signal Conditioning: Stable resistance in temperature or pressure sensor interfaces.
- Power Management: Current-limiting networks in low-power DC/DC converters.
- Test & Measurement Equipment: Calibration circuits demanding tight tolerance (±5%) and low TCR.
Conclusion of GS8B022940JT
The GS8B022940JT combines high reliability, compact form factor, and excellent thermal stability, making it a versatile choice for industrial electronics, instrumentation, and communication systems. Its bussed design reduces component count, while the ceramic case ensures durability in harsh environments. Though not RoHS-compliant, it remains a cost-effective solution for non-regulated markets requiring robust performance. Engineers will appreciate its balance of precision, power handling, and ease of integration in surface-mount layouts.



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