TT Electronics/IRC

GS8B022941DDT

GS8B022941DDT Description

The GS8B022941DDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 thin-film resistors with a 2.94KΩ resistance value and an absolute tolerance of ±0.5%. Its ±50ppm/°C temperature coefficient ensures stability across a wide operating temperature range of 70°C to 125°C, making it suitable for environments requiring tight resistance matching. The 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable performance in compact designs. With a 100V maximum voltage rating and gull-wing termination, it is optimized for surface-mount assembly in space-constrained PCBs.

GS8B022941DDT Features

• Precision Thin-Film Technology: Delivers ±0.5% tolerance and low TCR (±50ppm/°C) for stable performance.
• Robust Ceramic Package: SOIC-C case style ensures durability and thermal stability.
• High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm footprint.
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its precision suits industrial and instrumentation use.
• Surface-Mount Optimized: 1.27mm terminal pitch and gull-wing leads facilitate automated PCB assembly.

GS8B022941DDT Applications

• Signal Conditioning: Ideal for ADC/DAC reference networks and voltage dividers in test equipment.
• Industrial Controls: Used in PLC modules, sensor interfaces, and power management circuits.
• Medical Electronics: Suitable for patient monitoring systems due to low drift and high accuracy.
• Communications: Ensures signal integrity in RF matching networks and filter circuits.
• Aerospace & Defense: Non-RoHS compliant version may be used in legacy systems requiring ceramic reliability.

Conclusion of GS8B022941DDT

The GS8B022941DDT excels in applications demanding precision, thermal stability, and compact integration. Its ceramic construction, tight tolerances, and bussed architecture make it a superior choice over polymer-based networks in high-temperature or high-reliability scenarios. While not suited for automotive use, it is a cost-effective solution for industrial, medical, and communication systems where accuracy and longevity are critical. Engineers should verify unconfirmed part status for production readiness.