TT Electronics/IRC

GS8B023012FDT

GS8B023012FDT Description

The GS8B023012FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 thin-film resistors with a 30.1KΩ resistance value and a tight ±1% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable power dissipation, while the 100V maximum voltage rating accommodates moderate voltage applications.

GS8B023012FDT Features

• Ceramic Case & Thin-Film Technology: Ensures durability and precision with low noise and high stability.
• Bussed Network (BUS): Simplifies circuit design by interconnecting resistors, reducing component count.
• Narrow SOIC Package (9.91mm x 5.99mm x 1.45mm): Space-efficient for high-density PCB layouts.
• Gull Wing Termination: Facilitates easy surface-mount (SMD) assembly with a 1.27mm terminal pitch.
• Robust Performance: ±0.5% ratio tolerance and 1% absolute tolerance for critical analog/digital signal conditioning.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.

GS8B023012FDT Applications

Ideal for precision circuitry requiring stable resistance values under thermal stress, such as:

• Analog Signal Processing: Voltage dividers, gain networks in op-amp circuits.
• Industrial Controls: PLCs, sensor interfaces, and instrumentation.
• Telecommunications: Line termination, impedance matching.
• Automotive (Non-Automotive Compliant): Prototyping or non-safety-critical systems.
• Test & Measurement Equipment: Calibration networks, reference circuits.

Conclusion of GS8B023012FDT

The GS8B023012FDT excels in precision, thermal stability, and space efficiency, making it a standout choice for high-reliability networks. While not PPAP or automotive-qualified, its ceramic construction, thin-film technology, and tight tolerances cater to industrial and telecom applications where accuracy and durability are paramount. Engineers will appreciate its simplified bussed design and SOIC compatibility, reducing layout complexity without sacrificing performance.