


TT Electronics/IRC
GS8B023090FDT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS8B023090FDT Description
GS8B023090FDT Description
The GS8B023090FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 309Ω resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.5%. Built with thin-film technology, it ensures excellent stability and low noise, making it ideal for sensitive circuits. The SOIC package (9.91mm × 5.99mm × 1.45mm) provides a compact footprint, while the gull-wing termination ensures reliable surface-mount assembly. Rated for 100V maximum voltage and 0.05W power per resistor (0.8W total), it operates across a wide temperature range of -70°C to +125°C, with a ±50ppm/°C temperature coefficient.
GS8B023090FDT Features
- Ceramic case for enhanced thermal and mechanical stability.
- Thin-film technology ensures precision (±1% tolerance) and low TCR (±50ppm/°C).
- Bussed network (15 resistors) simplifies PCB layout in bus-line applications.
- Narrow SOIC (16-pin) saves board space while maintaining high-density integration.
- Gull-wing termination for robust surface-mount soldering.
- Wide operating range (-70°C to +125°C) suitable for industrial environments.
- High voltage rating (100V) for robust performance in power-sensitive designs.
GS8B023090FDT Applications
This resistor network excels in:
- Analog signal conditioning (DAC/ADC interfaces, sensor networks).
- Voltage division and bus termination in digital systems (FPGA, microcontroller circuits).
- Industrial control systems requiring stable, low-drift resistance.
- Automotive electronics (non-AECQ qualified; suitable for non-safety-critical functions).
- Medical instrumentation where precision and reliability are critical.
Conclusion of GS8B023090FDT
The GS8B023090FDT stands out for its ceramic construction, thin-film precision, and compact SOIC packaging, making it a superior choice for high-density, high-reliability applications. Its bussed design, tight tolerances, and wide temperature range make it ideal for industrial, medical, and communication systems where stability and space efficiency are paramount. While not PPAP or automotive-qualified, it remains a cost-effective solution for non-safety-critical precision circuits.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










