TT Electronics/IRC

GS8B023090GFT

GS8B023090GFT Description

The GS8B023090GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 309Ω resistance value, offering an absolute tolerance of ±2% and a ratio tolerance of ±1%. Built with thin-film technology, it ensures stable performance across a wide temperature range of -70°C to +125°C, supported by a low temperature coefficient of ±50ppm/°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing termination is optimized for surface-mount assembly, making it ideal for space-constrained PCB designs. With a maximum voltage rating of 100V and a power rating of 0.8W (0.05W per resistor), it balances durability and efficiency.

GS8B023090GFT Features

• Bussed Network: 15 resistors in a single package simplify circuit design and reduce component count.
• High Precision: ±2% absolute tolerance and ±1% ratio tolerance ensure consistent performance.
• Robust Construction: Ceramic substrate and thin-film technology enhance thermal stability and reliability.
• Wide Temperature Range: Operates from -70°C to +125°C, suitable for harsh environments.
• Low TCR: ±50ppm/°C minimizes resistance drift under thermal stress.
• Compact SOIC Package: 16-pin narrow profile (1.63mm seated height) saves board space.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its performance parallels higher-tier options.

GS8B023090GFT Applications

• Industrial Control Systems: Precision signal conditioning and voltage division.
• Medical Electronics: Stable performance in diagnostic equipment and sensors.
• Telecommunications: Impedance matching and termination in high-frequency circuits.
• Test & Measurement: Calibration circuits requiring tight tolerance and low drift.
• Power Management: Current sensing and feedback networks in DC/DC converters.

Conclusion of GS8B023090GFT

The GS8B023090GFT excels in applications demanding precision, compactness, and thermal resilience. Its bussed architecture reduces layout complexity, while thin-film technology ensures long-term stability. Though not RoHS-compliant, it remains a cost-effective solution for industrial and telecom systems where tight tolerances and low TCR are critical. Engineers will appreciate its balance of performance and footprint efficiency in high-density designs.