TT Electronics/IRC

GS8B023300DT

GS8B023300DT Description

The GS8B023300DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device integrates 15 bussed resistors with a 330Ω resistance value and an exceptional ±0.5% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers a low ±50ppm/°C temperature coefficient, making it stable across a wide operating temperature range of 70°C to 125°C. The SOIC package features gull-wing terminations for secure surface-mount (SMD) assembly, with a compact footprint of 9.91mm × 5.99mm × 1.45mm and tight dimensional tolerances. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for space-constrained designs requiring high accuracy and thermal resilience.

GS8B023300DT Features

• Precision Network: 15 bussed resistors with 0.5% tolerance and ±50ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case (SOIC-C series) ensures durability and thermal conductivity.
• High Power Handling: 0.05W per resistor (0.8W total) at 125°C derated power.
• Compact & Reliable: Narrow SOIC-16 package with 1.27mm pitch for high-density PCB layouts.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and instrumentation use.
• Surface-Mount Ready: Gull-wing terminals facilitate automated assembly processes.

GS8B023300DT Applications

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Industrial Control Systems: Stable resistance networks for PLCs and motor drives.
• Test & Measurement Equipment: High-accuracy circuits in multimeters or oscilloscopes.
• Power Management: Current-limiting or pull-up networks in DC/DC converters.
• Automotive Electronics: Non-automotive grade but suitable for benign-environment subsystems.

Conclusion of GS8B023300DT

The GS8B023300DT excels in applications demanding tight tolerance, thermal stability, and compact form factors. Its ceramic thin-film design and bussed architecture reduce component count while maintaining precision, making it a cost-effective solution for industrial, instrumentation, and communication systems. While not PPAP or automotive-qualified, its 125°C rating and low TCR ensure reliability in harsh environments. Engineers will appreciate its balance of performance, size, and power handling for high-density PCB designs.