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GS8B023831GGT
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GS8B023831GGT Description
GS8B023831GGT Description
The GS8B023831GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 3.83KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it delivers excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with operating temperatures ranging from 70°C to 125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) offers a compact footprint, ideal for space-constrained designs. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling and precision.
GS8B023831GGT Features
- Bussed Network Design: Simplifies circuit layout with 15 interconnected resistors.
- High Precision: ±2% tolerance and ±50ppm/°C thermal stability for reliable performance.
- Robust Construction: Ceramic substrate ensures durability and heat dissipation.
- Surface-Mount Gull Wing Terminals: Facilitates automated assembly with a 1.27mm pitch.
- Wide Temperature Range: Operates from 70°C to 125°C with derated power.
- Compact SOIC Package: 9.91mm x 5.99mm footprint, ideal for dense PCB layouts.
- Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications.
GS8B023831GGT Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage dividers and pull-up/pull-down networks.
- Analog Circuits: Feedback networks in op-amps and ADC/DAC interfaces.
- Industrial Controls: Sensor calibration and instrumentation requiring stable resistance.
- Communication Systems: Impedance matching and termination in high-frequency PCBs.
- Power Management: Current limiting and bias networks in low-power designs.
Conclusion of GS8B023831GGT
The GS8B023831GGT combines precision, compactness, and thermal stability, making it a standout choice for industrial and commercial electronics. Its bussed design reduces component count, while thin-film technology ensures long-term reliability. Though not PPAP or automotive-grade, it is ideal for high-density, temperature-variable environments where accuracy and space efficiency are critical. Engineers will appreciate its balance of performance, size, and cost in demanding applications.



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