TT Electronics/IRC

GS8B023901FDT

GS8B023901FDT Description

The GS8B023901FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC (SOIC-C) package, it features 15 bussed thin-film resistors with a 3.9KΩ resistance value and a tight ±1% absolute tolerance. The device operates over a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in demanding environments. Its ±50ppm/°C temperature coefficient and ±0.5% ratio tolerance make it ideal for applications requiring stable and matched resistances. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating further enhance its versatility.

GS8B023901FDT Features

• Ceramic substrate for superior thermal stability and durability.
• Thin-film technology ensures low noise and high precision.
• Bussed network (BUS) simplifies circuit design with shared connections.
• 1.27mm terminal pitch and gull-wing termination for easy surface-mount assembly.
• Compact dimensions (9.91mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-automotive (PPAP: No) but suitable for industrial and telecom applications.
• 0.8W total power rating for robust performance in multi-resistor configurations.

GS8B023901FDT Applications

This resistor network excels in:

• Precision analog circuits requiring matched resistances (e.g., differential amplifiers, voltage dividers).
• Signal conditioning in industrial control systems and measurement equipment.
• Telecommunications hardware, where stable impedance is critical.
• Power management modules leveraging its high-voltage tolerance (100V).
• Embedded systems needing compact, high-density resistor arrays.

Conclusion of GS8B023901FDT

The GS8B023901FDT stands out for its ceramic construction, thin-film precision, and bussed topology, offering engineers a reliable solution for space-constrained, high-accuracy designs. While not RoHS-compliant, its wide temperature range, low TCR, and tight tolerances make it a preferred choice for industrial and telecom applications demanding long-term stability. Its SOIC package ensures compatibility with standard PCB assembly processes, further broadening its usability.