TT Electronics/IRC

GS8B023902BT

GS8B023902BT Description

The GS8B023902BT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 39KΩ resistance value and an exceptional ±0.1% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers a low ±50ppm/°C temperature coefficient, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations enables easy surface-mount assembly, while its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage environments.

GS8B023902BT Features

• Precision Performance: ±0.1% tolerance and ±50ppm/°C TCR for stable operation in varying conditions.
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Space-Efficient Design: 16-pin SOIC package (9.91mm x 5.99mm) with 1.27mm terminal pitch optimizes PCB space.
• High Voltage Handling: Supports up to 100V, ideal for industrial and automotive systems (though not PPAP/automotive-qualified).
• Bussed Network: 15 resistors share a common node (BUS designator), simplifying circuit layouts.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power at elevated temperatures.

GS8B023902BT Applications

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces requiring tight tolerance.
• Industrial Electronics: PLCs, instrumentation, and control systems where thermal stability is critical.
• Communications Equipment: Signal conditioning and impedance matching in RF/mixed-signal PCBs.
• Test & Measurement: Calibration devices and reference circuits due to low TCR and high accuracy.
• Power Management: Low-power voltage regulation or current limiting in compact designs.

Conclusion of GS8B023902BT

The GS8B023902BT stands out for its combination of precision, compactness, and ruggedness, making it a superior choice for applications demanding high accuracy and thermal resilience. While not automotive-grade, its ceramic construction, thin-film technology, and bussed design offer distinct advantages over polymer-based or discrete alternatives. Engineers will appreciate its ease of integration, consistent performance, and reliability in harsh environments, solidifying its role in advanced electronic systems.