TT Electronics/IRC

GS8B024020JCT

GS8B024020JCT Description

The GS8B024020JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a common 402Ω resistance value and a tight ±5% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -55°C to +125°C, with derated power handling up to 125°C. The SOIC-C series construction features a rectangular ceramic substrate with gull-wing terminations, offering excellent thermal and mechanical stability. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it suits compact, high-density designs.

GS8B024020JCT Features

• Ceramic substrate for superior thermal management and durability.
• Thin-film technology delivers precise resistance values (±5%) and low TCR (±50ppm/°C).
• Bussed network (BUS) simplifies PCB layout by connecting multiple resistors to a common node.
• 16-pin SOIC package (9.91mm x 5.99mm x 1.45mm) with 1.27mm terminal pitch for space-efficient surface mounting.
• Wide temperature range (-55°C to +125°C) with derated power up to 125°C.
• High power density: 0.8W total dissipation (0.05W per resistor).
• Gull-wing terminations ensure reliable solder joints in automated assembly.
• Non-compliant with EU RoHS, making it suitable for legacy or exempted applications.

GS8B024020JCT Applications

• Voltage dividers and pull-up/down networks in industrial control systems.
• Signal conditioning circuits for sensors and ADCs in automotive (non-AEC-Q200) and aerospace electronics.
• Impedance matching in RF and communication modules.
• Power supply feedback networks requiring stable resistance over temperature.
• Legacy equipment maintenance where RoHS compliance is not mandatory.

Conclusion of GS8B024020JCT

The GS8B024020JCT excels in precision, thermal stability, and space-saving design, making it ideal for high-reliability applications in harsh environments. Its ceramic construction and thin-film technology provide superior performance over polymer-based networks, while the bussed architecture reduces PCB complexity. Though not RoHS-compliant, it remains a robust choice for industrial, aerospace, and legacy systems demanding tight tolerances and durability. Engineers will appreciate its balance of power handling, compact footprint, and temperature resilience in critical circuits.