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GS8B024421JBT
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GS8B024421JBT Description
GS8B024421JBT Description
The GS8B024421JBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC (SOIC-C Series) device integrates 15 bussed resistors with a 4.42KΩ resistance value and a ±5% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers a low temperature coefficient of ±50ppm/°C, making it stable across a wide operating temperature range of -70°C to +125°C. The 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable operation in compact designs. Its gull-wing termination and surface-mount package (9.91mm x 5.99mm x 1.45mm) facilitate easy PCB integration.
GS8B024421JBT Features
- Bussed Network Design: Simplifies circuit layout with shared connections.
- High Precision: ±5% absolute tolerance and ±0.1% ratio tolerance for matched resistance values.
- Robust Construction: Ceramic case ensures durability and thermal stability.
- Wide Voltage Range: Supports up to 100V maximum voltage.
- Low TCR: ±50ppm/°C minimizes resistance drift with temperature fluctuations.
- Compact Form Factor: SOIC-16 package with 1.27mm terminal pitch saves board space.
- Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, similar variants may suit harsh environments.
GS8B024421JBT Applications
- Signal Conditioning: Ideal for voltage dividers and pull-up/down networks in analog circuits.
- Industrial Controls: Suitable for PLCs, sensor interfaces, and instrumentation due to its stability.
- Consumer Electronics: Used in audio equipment, displays, and power management systems.
- Telecommunications: Ensures signal integrity in RF and filtering applications.
- Test & Measurement: Precision tolerance suits calibration and reference circuits.
Conclusion of GS8B024421JBT
The GS8B024421JBT excels in space-constrained, precision applications requiring stable resistance values under varying temperatures. Its thin-film ceramic construction, low TCR, and bussed design offer distinct advantages over thicker-film or discrete alternatives. While not RoHS-compliant, it remains a robust choice for industrial and telecom systems where reliability outweighs regulatory constraints. Engineers will appreciate its balance of performance, compactness, and ease of integration in high-density PCBs.



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