TT Electronics/IRC

GS8B024700JBT

GS8B024700JBT Description

The GS8B024700JBT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 470Ω resistance and a ±5% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for industrial and automotive-grade circuits. The SOIC-C series construction offers robust ceramic substrate durability, while the gull-wing termination facilitates reliable surface-mount assembly. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness with performance.

GS8B024700JBT Features

• Precision Network: 15 bussed resistors with ±0.1% ratio tolerance for matched performance.
• High-Temperature Stability: ±50ppm/°C TCR and 125°C max operating temperature ensure reliability in thermal stress.
• Robust Construction: Ceramic case and thin-film technology provide low noise and long-term stability.
• Compact & Efficient: 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch for high-density PCB designs.
• Wide Compatibility: SOIC package aligns with industry standards for easy integration.

GS8B024700JBT Applications

• Voltage Division: Ideal for ADC/DAC reference networks due to tight ratio tolerance.
• Signal Conditioning: Used in sensor interfaces and op-amp circuits requiring stable resistance matching.
• Industrial Controls: Suitable for PLC modules and power management systems in harsh environments.
• Automotive Electronics: Despite non-automotive PPAP status, its wide temperature range supports under-hood applications.
• Consumer Electronics: Compact size benefits portable devices and IoT hardware.

Conclusion of GS8B024700JBT

The GS8B024700JBT excels in precision and durability, leveraging ceramic thin-film technology for applications demanding tight tolerances and thermal resilience. Its bussed design simplifies circuit layout, while the SOIC package ensures compatibility with automated assembly. While not PPAP-certified, its performance metrics make it a versatile choice for industrial, automotive, and high-end consumer electronics. Engineers will appreciate its balance of size, power handling, and stability in critical designs.