TT Electronics/IRC

GS8B024701GGT

GS8B024701GGT Description

The GS8B024701GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 4.7KΩ resistance value and a tight ±2% absolute tolerance. The thin-film technology ensures excellent stability, with a low ±50ppm/°C temperature coefficient, making it suitable for environments with operating temperatures up to 125°C. Its 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable performance in compact designs. The 100V maximum voltage rating and gull-wing termination enable robust surface-mount integration.

GS8B024701GGT Features

• Ceramic Case: Ensures durability and thermal stability in harsh conditions.
• Bussed Network (BUS): Simplifies circuit design by connecting multiple resistors in a single package.
• Precision Thin Film: Delivers low TCR (±50ppm/°C) and tight tolerance (±2%).
• High-Temp Operation: Rated for 70°C to 125°C with derated power handling.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances.
• Surface-Mount Ready: 1.27mm terminal pitch for easy PCB assembly.

GS8B024701GGT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Industrial Control Systems: Stable resistance in PLCs and motor drivers.
• Automotive Electronics: Non-automotive grade but suitable for benign environments.
• Test & Measurement Equipment: High-accuracy circuits requiring minimal drift.
• Power Management: Current limiting and bias networks in compact power supplies.

Conclusion of GS8B024701GGT

The GS8B024701GGT stands out for its ceramic construction, bussed design, and thin-film precision, offering superior thermal and electrical stability. While not PPAP or automotive-qualified, it is ideal for industrial, instrumentation, and consumer electronics where space efficiency and reliability are critical. Its SOIC package and gull-wing leads ensure compatibility with automated assembly processes, making it a cost-effective solution for high-volume production.