TT Electronics/IRC

GS8B024750FCT

GS8B024750FCT Description

The GS8B024750FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 475Ω resistance value and a tight ±1% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C. The device features gull-wing terminations for reliable surface-mount assembly and delivers a total power rating of 0.8W (0.05W per resistor). With a 100V maximum voltage rating, it is engineered for robustness in industrial and instrumentation circuits.

GS8B024750FCT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology ensures low noise and high precision (±0.25% ratio tolerance).
• Compact SOIC package (9.91mm × 5.99mm × 1.45mm) with ±0.1mm dimensional tolerances.
• Bussed configuration simplifies circuit design for common-bus applications.
• Wide temperature range (-70°C to +125°C) with derated power up to 125°C.
• 1.27mm terminal pitch for compatibility with standard PCB layouts.
• Non-automotive grade (PPAP: No), ideal for industrial and telecom systems.

GS8B024750FCT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down networks in precision analog circuits.
• Signal conditioning for sensors and data acquisition systems.
• Industrial control modules requiring stable resistance under thermal stress.
• Telecommunication infrastructure where consistent impedance matching is critical.
• Test and measurement equipment demanding low TCR and high accuracy.

Conclusion of GS8B024750FCT

The GS8B024750FCT stands out for its ceramic-based construction, tight tolerances, and bussed architecture, making it a superior choice for high-reliability applications. While not RoHS-compliant, its thermal performance and precision cater to specialized industrial and instrumentation needs. Engineers will benefit from its space-saving SOIC package and consistent thin-film performance, particularly in environments where temperature fluctuations and signal integrity are key concerns.