TT Electronics/IRC

GS8B024991JAT

GS8B024991JAT Description

The GS8B024991JAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed array integrates 15 thin-film resistors with a 4.99KΩ resistance value and a ±5% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating range of 70°C to 125°C, making it suitable for thermally challenging conditions. The device offers a 0.8W total power rating (0.05W per resistor) and supports 100V maximum voltage, housed in a compact 9.91mm × 5.99mm × 1.45mm ceramic package with gull-wing terminations for reliable surface-mount assembly.

GS8B024991JAT Features

• Robust Construction: Ceramic case ensures durability and excellent thermal dissipation.
• Precision Performance: Thin-film technology delivers ±0.05% ratio tolerance for matched resistance values.
• High-Density Integration: 15 resistors in a space-saving SOIC-16 footprint.
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
• Automated Assembly Ready: 1.27mm terminal pitch and gull-wing leads optimize pick-and-place efficiency.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications where PPAP compliance is not required.

GS8B024991JAT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and pull-up/down networks in ADC/DAC circuits.
• Industrial Controls: Robust performance for PLC I/O modules and sensor interfaces.
• Test & Measurement Equipment: Stable resistance matching for calibration circuits.
• Power Management: Current-limiting and feedback networks in DC-DC converters.
• Aerospace & Defense: Ceramic packaging suits high-reliability systems (though non-RoHS).

Conclusion of GS8B024991JAT

The GS8B024991JAT combines high precision, thermal resilience, and compact integration, making it a standout choice for industrial electronics, instrumentation, and power systems. Its ceramic SOIC package and thin-film technology offer superior stability over plastic alternatives, while the bussed design simplifies circuit routing. Though not RoHS-compliant, its wide temperature range and tight ratio tolerance justify its use in specialized applications where performance outweighs regulatory constraints.