TT Electronics/IRC

GS8B025111FFT

GS8B025111FFT Description

The GS8B025111FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 5.11KΩ resistance value and a tight ±1% absolute tolerance. The thin-film technology ensures low temperature coefficient (±50ppm/°C) and stable performance across a wide temperature range (70°C to 125°C). With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, this network is ideal for demanding circuits requiring reliability and accuracy. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B025111FFT Features

• Bussed Network Design: Simplifies circuit layout with shared connections, reducing component count.
• High Precision: ±1% tolerance and ±50ppm/°C TCR ensure minimal drift in critical applications.
• Robust Construction: Ceramic case enhances thermal stability and durability.
• Compact Footprint: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances.
• Wide Operating Range: Rated for -55°C to +125°C, suitable for industrial environments.
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads for automated assembly.

GS8B025111FFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance (±1%) ensures accurate signal conditioning.
• Industrial Control Systems: Stable performance under thermal stress (up to 125°C).
• Automotive Electronics: Though not PPAP/automotive-certified, its robustness suits non-safety-critical modules.
• Test & Measurement Equipment: Low TCR minimizes calibration drift.
• Power Management: Handles derated power up to 125°C for reliable operation.

Conclusion of GS8B025111FFT

The GS8B025111FFT stands out for its precision, compactness, and thermal resilience, making it a superior choice for bussed resistor networks in industrial and instrumentation designs. Its ceramic construction and thin-film technology offer long-term stability, while the SOIC package ensures compatibility with high-density PCBs. Engineers seeking a cost-effective, high-tolerance solution for signal processing or power distribution will find this model exceptionally reliable.