TT Electronics/IRC

GS8B025602FFT

GS8B025602FFT Description

The GS8B025602FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 16-pin narrow SOIC package features 15 bussed resistors, each with a 56KΩ resistance and a tight ±1% absolute tolerance. Built using thin-film technology, it delivers excellent stability with a low ±50ppm/°C temperature coefficient, ensuring reliable performance across a wide temperature range (70°C to 125°C). The SOIC-C series construction provides robust mechanical durability, while the gull-wing termination enables secure surface-mount assembly. With a 0.05W (1/20) power rating per resistor and a 100V maximum voltage rating, this network is ideal for compact, high-density PCB designs requiring consistent resistance matching.

GS8B025602FFT Features

• Ceramic substrate for superior thermal and mechanical stability.
• 15 bussed resistors in a 16-pin SOIC package, optimizing space efficiency.
• Thin-film technology ensures low noise and high precision (±1% tolerance).
• ±50ppm/°C TCR for minimal resistance drift under temperature fluctuations.
• 0.8W total power dissipation (0.05W per resistor) with derating up to 125°C.
• Gull-wing leads for reliable surface-mount soldering (1.27mm pitch).
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H), ±0.1mm tolerance.
• Non-automotive grade, suitable for industrial and commercial applications.

GS8B025602FFT Applications

• Voltage division and signal conditioning in precision analog circuits.
• Pull-up/pull-down networks in digital logic systems.
• Sensor interface circuits requiring stable, matched resistances.
• Medical and test equipment where low TCR and tight tolerances are critical.
• Power management modules in telecom and networking hardware.
• Embedded systems with space constraints, leveraging its SOIC footprint.

Conclusion of GS8B025602FFT

The GS8B025602FFT stands out for its ceramic-based construction, thin-film precision, and robust SOIC packaging, making it a superior choice for applications demanding thermal stability, space efficiency, and consistent performance. While not PPAP or automotive-qualified, its 1% tolerance and low TCR make it ideal for industrial, medical, and high-reliability electronics. Engineers will appreciate its balance of power handling, compactness, and reliability in critical circuit designs.