TT Electronics/IRC

GS8B025602JDT

GS8B025602JDT Description

The GS8B025602JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values under varying thermal conditions. This 16-pin narrow SOIC device features 15 bussed resistors with a 56KΩ resistance value, offering an absolute tolerance of ±5% and a ratio tolerance of ±0.5%. Built with thin-film technology, it ensures low noise and high reliability, making it ideal for analog and digital signal conditioning. The SOIC package (9.91mm x 5.99mm x 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for robust solder joints. Rated for 100V maximum voltage and 0.05W (1/20W) power dissipation per resistor, it operates across a wide temperature range of -55°C to +125°C, with derated performance up to 125°C.

GS8B025602JDT Features

• Ceramic substrate for superior thermal stability and mechanical durability.
• Thin-film resistors with ±50ppm/°C temperature coefficient, ensuring minimal drift.
• Bussed network topology simplifies PCB layout and reduces component count.
• 16-pin SOIC package with 1.27mm terminal pitch, compatible with automated pick-and-place systems.
• High power rating (0.8W total) for a compact footprint, outperforming similar networks.
• Non-automotive grade with PPAP: No, suitable for industrial and consumer electronics.
• Non-RoHS compliant, catering to legacy or specialized applications.

GS8B025602JDT Applications

This resistor network excels in:

• Voltage dividers and pull-up/down circuits in microcontroller interfaces.
• Signal conditioning for sensors, ADCs, and DACs in test/measurement equipment.
• Impedance matching in RF and communication systems.
• Power supply feedback networks requiring tight tolerance ratios.
• Industrial control systems where ceramic construction resists vibration and thermal stress.

Conclusion of GS8B025602JDT

The GS8B025602JDT stands out for its ceramic-based reliability, precision thin-film resistors, and space-saving SOIC package. While not suited for automotive use, its ±50ppm/°C stability and bussed design make it a cost-effective solution for high-density PCBs in harsh environments. Engineers will appreciate its balance of performance, durability, and ease of integration in industrial, medical, and instrumentation designs.