TT Electronics/IRC

GS8B026192GGT

GS8B026192GGT Description

The GS8B026192GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 16-pin narrow SOIC device features 15 bussed resistors with a 61.9KΩ resistance value, offering an absolute tolerance of ±2% and a ratio tolerance of ±2%. Built with thin-film technology, it ensures stable performance with a low temperature coefficient of ±50ppm/°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for reliable solder joints. Rated for 100V maximum voltage and 0.8W total power dissipation, it operates within a wide temperature range of -70°C to +125°C, making it suitable for industrial and commercial applications.

GS8B026192GGT Features

• Bussed Network Configuration: Simplifies circuit design by connecting multiple resistors in a single package.
• High Precision: ±2% tolerance and ±50ppm/°C TCR ensure consistent performance under thermal stress.
• Robust Construction: Ceramic substrate enhances durability and thermal stability.
• Space-Efficient: Compact SOIC-C series footprint (9.91mm length) saves PCB real estate.
• Wide Operating Range: Derated power up to 125°C for harsh environments.
• Surface-Mount Ready: Gull-wing terminals (1.27mm pitch) facilitate automated assembly.

GS8B026192GGT Applications

• Voltage Division Circuits: Ideal for precision dividers in sensor interfaces.
• Signal Conditioning: Used in ADC/DAC reference networks for minimal drift.
• Industrial Controls: Reliable performance in PLCs and motor drivers.
• Automotive Electronics: Suitable for non-safety-critical systems (non-AEC-Q200).
• Test & Measurement Equipment: Stable resistance for calibration and instrumentation.

Conclusion of GS8B026192GGT

The GS8B026192GGT excels in precision, thermal stability, and compactness, making it a superior choice for high-density PCBs and temperature-variable environments. While not automotive-grade, its ceramic construction and thin-film technology provide long-term reliability for industrial, medical, and communication systems. Engineers will appreciate its ease of integration and consistent performance, reducing design complexity and BOM costs.