TT Electronics/IRC

GS8B026492GDT

GS8B026492GDT Description

The GS8B026492GDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed resistor array features 15 thin-film resistors, each with a resistance value of 64.9 kΩ and a tight ±2% absolute tolerance (±0.5% ratio tolerance). Its ±50 ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction provides excellent durability, with a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating.

GS8B026492GDT Features

• Ceramic substrate for enhanced thermal stability and reliability.
• Thin-film technology ensures low noise and high precision.
• Gull-wing termination for secure surface-mount (SMD) assembly.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H), with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Bussed (common-bus) topology simplifies circuit design for shared-voltage applications.
• Non-automotive grade (PPAP: No) but ideal for industrial, telecom, and instrumentation use.
• Non-RoHS compliant, catering to legacy or specialized applications.

GS8B026492GDT Applications

This resistor network excels in:

• Voltage divider circuits requiring matched resistance ratios (±0.5% tolerance).
• Signal conditioning in data acquisition systems and sensor interfaces.
• Industrial control systems where temperature stability (±50ppm/°C) is critical.
• Power supply feedback networks due to its 100V voltage rating.
• Legacy electronics repair where non-RoHS compliance is acceptable.

Conclusion of GS8B026492GDT

The GS8B026492GDT stands out for its precision, thermal resilience, and compact SOIC footprint, making it a robust choice for engineers designing high-reliability analog circuits. While not suited for automotive applications, its ceramic construction and thin-film technology offer superior performance in industrial and telecom environments. The bussed architecture reduces component count, streamlining PCB layouts. For projects demanding stable, high-tolerance resistor networks, this model delivers a compelling balance of accuracy and durability.