TT Electronics/IRC

GS8B026492JAT

GS8B026492JAT Description

The GS8B026492JAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values and compact packaging. This 16-pin narrow SOIC device features 15 bussed resistors with a 64.9KΩ resistance value, offering an absolute tolerance of ±5% and an exceptional ratio tolerance of ±0.05%. Built with thin-film technology, it ensures low noise and high reliability, making it ideal for signal conditioning, voltage division, and impedance matching in demanding environments. The SOIC-C series construction provides excellent thermal stability, with a temperature coefficient of ±50ppm/°C and a power rating of 0.05W per resistor (0.8W total).

GS8B026492JAT Features

• Ceramic Case & Thin Film Technology: Ensures high durability and low thermal drift.
• Bussed Network (15 Resistors): Simplifies PCB layout by reducing discrete component count.
• Precision Tolerance: ±5% absolute, ±0.05% ratio tolerance for matched performance.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions, 1.27mm terminal pitch, and gull-wing termination for easy surface mounting.
• High Voltage Rating: Supports up to 100V, suitable for industrial and automotive-grade designs (though not PPAP/automotive certified).
• Non-RoHS Compliant: For applications exempt from RoHS restrictions.

GS8B026492JAT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces.
• Industrial Control Systems: Signal conditioning in PLCs, motor drives, and instrumentation.
• Test & Measurement Equipment: Calibration circuits and reference networks.
• Telecom Infrastructure: Impedance matching in RF and high-speed data lines.
• Legacy or Non-RoHS Designs: Where ceramic stability outweighs compliance requirements.

Conclusion of GS8B026492JAT

The GS8B026492JAT combines high precision, compact form factor, and robust ceramic construction, making it a standout choice for engineers prioritizing reliability in harsh environments. Its bussed design reduces assembly complexity, while the thin-film technology ensures consistent performance across temperature fluctuations. While not suited for automotive or RoHS-mandated projects, it remains a top-tier solution for industrial, telecom, and precision analog applications where stability and space efficiency are critical.